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04 – PCB base materials and their properties
04.1 Base material types classified according to their use
Name |
Design |
Use |
Contour |
FR2 |
Paper-base laminate, phenolic resin
Cu single- and double-sided,
18, 35, 70 µm |
Single- and double-sided PCBs,
non-plated through PCBs |
Routing / scoring,
can be punched at room temperature |
CEM1 |
Core: Paper, epoxy resin
Exterior: Glass fibre epoxy resin,
Cu single- and double-sided,
18, 35, 70 µm |
Single- and double-sided PCBs,
double-sided, non-plated through PCBs |
Routing / scoring |
CEM3 |
Core: Paper, epoxy resin
Exterior: Glass fibre epoxy resin,
Cu single- and double-sided,
18, 35, 70 μm |
Single- and double-sided PCBs,
double-sided, non-plated through PCBs |
Routing / scoring,
can be punched at room temperature |
FR4 |
Glass fibre, epoxy resin
Cu single- and double-sided,
18, 35, 70, 105 µm
(others on request) |
Single- and double-sided PCBs,
double-sided, non-plated through PCBs,
multilayer |
Routing / scoring |
FR4 High Tg
(FR5) |
Glass fibre, epoxy resin
Cu single- and double-sided,
18, 35, 70, 105 µm
(others on request) |
Single- and double-sided PCBs,
double-sided, non-plated through PCBs,
multilayer |
Routing / scoring |
Teflon |
Teflon, glass fibre
Cu single- and double-sided,
18, 35, 70 µm
(others on request) |
Single- and double-sided PCBs,
double-sided, plated through PCBs,
multilayer,
high-frequency PCBs >1 GHz |
Routing / scoring |
Polyimid |
Cu single- and double-sided,
18, 35 µm |
Single- and double-sided PCBs,
double-sided, plated through PCBs,
multilayer, rigid-flex PCBs,
high temperature PCBs |
Routing / laser cutting, can be punched at room temperature |
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Standard thicknesses of rigid material:
0,5 mm / 0,8 mm / 1,0 mm / 1,2 mm / 1,6 mm / 2,0 mm / 2,4 mm / 3,2 mm / other thicknesses on request.
Polyimide can also be used as a rigid base material when reinforced with glass fibre, thickness 1,6 mm, other thicknesses on request.
04.2 Base materials and their technical properties
Property |
Unit |
Pre-
treatment |
FR2 |
CEM1 |
CEM3 |
FR4 |
FR4
High Tg |
Teflon |
Poly-
imide |
Glass transition
temperature Tg |
°C |
– |
30 |
60/90 |
125 |
135 |
150/170/210 |
160 |
> 250 |
Adherence of
CU foil |
N/mm |
– |
2,0 |
1,7 |
1,4 |
2,0 |
> 1,4 |
> 1,4 |
1,2 |
Bending strength
lengthwise
0,8 to 3,2 mm |
N/mm |
– |
160 |
400 |
480 |
600 |
600 |
600 |
110 |
Bending strength
crosswise
|
N/mm |
– |
140 |
320 |
330 |
450 |
490 |
490 |
100 |
Dielectric constant
at 1MHz
|
– |
*D 24/23 |
4,1 |
4,2 |
5,0 |
4,2–4,8 |
4,5–5,4 |
2,5–2,8 |
3,8 |
Electric strength |
kV |
*D 48/50 |
15 |
40 |
– |
40 |
– |
– |
90 |
Surface resistance |
Ohm |
*C 96/35/90 |
109 |
1011 |
1011 |
1011 |
1011 |
1011 |
1011 |
Volume resistivity |
Ohm/cm |
*C 96/35/90 |
1010 |
1013 |
– |
1012 |
– |
– |
1014 |
Solder-bath
resistance |
S |
– |
15–20 |
30 |
– |
120 |
– |
– |
– |
Combustibility
UL 94 |
– |
– |
V1 |
V0 |
V0 |
V0 |
V0 |
V0 |
V0 |
Creepage formation
DIN IEC 112 |
CTI |
– |
250 |
– |
– |
175–200 |
– |
– |
160–175 |
Water-
absorbation |
% |
*E 24/50 |
0,75 |
– |
– |
– |
– |
– |
2,5 |
Temperature
limit |
°C |
– |
105 |
– |
– |
– |
– |
– |
– |
Thermal
expansion |
Ppm/°K |
*E 0/100 |
270–330 |
300 |
190 |
170 |
100–200 |
100–200 |
– |
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*C – Pre-treatment in humid air | *D – Pre-treatment in distilled water | *E – Storage in drying chamber
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